Technology ❯Electronics ❯Semiconductors
Qualcomm Snapdragon Apple M5 Apple A18 Pro MediaTek Dimensity 9400+ Xiaomi XRING O1 Snapdragon 8 Elite Gen 2 Apple A20 Processor Exynos 2500 MediaTek Dimensity 9400 Design Incentive Schemes Tensor G5
Leaks suggest the unannounced chipset will use TSMC’s 3nm N3P process, with first implementation in Vivo’s X300 series.