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Leaks Point to Snapdragon 8 Elite Gen 6 With LPDDR6, UFS 5.0 as 2nm Plan Remains in Dispute

Leakers differ on a potential shift to TSMC’s N2P process, a decision that could lift chip costs and push flagship phone prices higher.

Overview

  • Qualcomm’s next flagship SoC is rumored to add LPDDR6 RAM and UFS 5.0 storage, with reports framing the upgrades as key for heavier on‑device AI workloads.
  • Digital Chat Station claims the chip will skip first‑generation 2nm and use TSMC’s refined N2P node, which TSMC projects could deliver up to 18% better performance or 36% lower power versus current 3nm.
  • Tipster Fixed Focus Digital counters that 2026 launches from Apple, Qualcomm, and MediaTek are more likely to use the initial N2 process rather than N2P.
  • Early reporting points to a late‑2026 debut and flags a significant increase in SoC pricing that manufacturers are expected to pass on to consumers.
  • Coverage notes tight early 2nm capacity and wafer costs around $30,000, with one outlet suggesting Qualcomm’s move could help it align with Samsung’s 2nm Exynos 2600 timeline.