Overview
- A Weibo tipster known as Mobile Phone Chip Expert claims Apple’s A20 and A20 Pro are codenamed “Borneo” and “Borneo Ultra,” with the Pro slated for iPhone 18 Pro models and the rumored first foldable.
- Outlets summarizing TSMC’s N2 node report 10–15% higher performance at the same power and 25–30% lower power at the same performance compared with 3nm N3E.
- Industry reports suggest early 2nm capacity is largely booked, with Apple said to have secured a significant share of initial output, though none of this is officially confirmed.
- Citations of China Times indicate 2nm wafer pricing could be about 50% higher than 3nm, a jump analysts say may pressure iPhone 18 and foldable pricing.
- Multiple reports say Apple may shift A-series packaging from inFO to WMCM for the A20 family to curb die size and costs, complementing the move to 2nm.