Overview
- TSMC told Taiwan’s National Science and Technology Council it will add three 2nm fabs in Tainan’s Southern Science Park, supplementing two in Hsinchu and five in Kaohsiung.
- The expansion carries an estimated initial cost of about NT$900 billion ($28 billion), with construction reportedly possible next year and mass production targeted for 2026.
- Combined 2nm capacity is expected to top roughly 100,000 wafers per month as the new sites ramp, with industry estimates seeing output doubling to 80,000–90,000 wafers by the end of next year.
- Local reporting indicates capital spending could rise to as much as $50 billion, with most directed to 2nm and the A16 node and to enlarging CoWoS advanced packaging capacity.
- Separate tipster reports suggest N2’s performance gains may be modest and wafer pricing manageable, with Apple and other early adopters expected to secure early supply.