Overview

• A Weibo tip from leaker Digital Chat Station claims MediaTek will unveil the Dimensity 9500 on September 22, one day before Qualcomm’s Snapdragon Summit
• Leaked Geekbench-style scores suggest the new SoC could deliver single-core results above 3,900 and multi-core performance exceeding 11,000
• Rumors indicate the chip will adopt a 2+6 CPU cluster instead of the prior 1+3+4 design and may support ARM’s Scalable Matrix Extension for enhanced AI workloads
• Reports say the Dimensity 9500 is expected to use TSMC’s third-generation 3nm N3P process, matching Qualcomm’s upcoming rival in fabrication node
• GPU configuration remains disputed between Immortalis-class and Mali-G1 Ultra designs and early device launches are tipped for Vivo X300 and OPPO Find X9 series