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Intel Ships First High-Volume Logic Chips Made With ASML High‑NA EUV

Demonstrating production-grade yield parity on select chip layers, the move presents steep cost and deployment challenges for wider adoption.

ASML Sets Course Beyond EUV With Packaging Tools as High‑NA Progresses

ASML Validates 1,000‑W EUV Light Source, Targeting 50% Higher Wafer Throughput by 2030

Jeep Recalls Nearly 113,000 Wrangler and Grand Cherokee 4xe SUVs Over Engine Casting Debris

Toyota Expands Engine-Defect Recall to 126,691 Tundra and Lexus SUVs

Tesla Unveils Redesigned Semi, Sets 2026 Nevada Volume Production

Mexico to Update 1-, 2- and 5-Peso Coins in 2025 With Electroplated Steel Cores

SK On Opens Daejeon All-Solid-State Battery Pilot Plant, Accelerates Commercialization to 2029

SK Hynix Completes HBM4 Development, Readies First Mass-Production System

Ford Will Unveil New Low-Cost EV Platform on August 11

Samsung to Use Inkjet Printing for Thinner Galaxy S26 Camera Modules

Apple's Foldable iPhone to Feature Advanced Metallic Glass Hinge

US Regulators Pause Massive Air Bag Recall for Further Investigation

NHTSA Reaffirms Safety Risks in 51 Million Air Bag Inflators