TSMC Chip Production Lithography GlobalFoundries Advanced Packaging 3nm Process Intel Chinese Foundries Chipmaking EUV Lithography Investment Patterning Techniques Microcontroller Units Qubit Fabrication Materials Memory Production SMIC Facilities Taiwan Semiconductor Manufacturing Company Outsourced Assembly Fabs Semiconductor Fabs Computer Chips Flexible Fibres Advanced Packaging Substrates TSMC's Capabilities Locations Future Adoption Packaging Facility CHIPS Act TSMC 4N Node TSMC N3B Intel Corp. Taiwan Semiconductor Manufacturing Co Taiwan Semiconductor Manufacturing Company (TSMC) Taiwan Semiconductor Manufacturing Co. Microchips Chip Development ASML Lithography Equipment Silicon Fabrication 5nm Process 3nm Technology Advanced Chip Machines Wafer Processing Joint Ventures Wafer Technology Lithography Process Advanced Packaging Technologies Foundry Process Nodes Wafer Manufacturing 3nm Process Technology Process Technology
Qualcomm’s SM8845 is slated to power Oppo, OnePlus and vivo phones with large batteries ahead of a late-September reveal of the Snapdragon 8 Elite 2 for Xiaomi.