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Peking University Unveils Prototype 3D EDA for Huawei’s LogicFolding Push

The development shows China pursuing 3D stacking and domestic design tools to try to close the chip gap created by export limits.

Reports Split on Samsung’s Exynos 2700 Packaging Plan

Reports Point to Samsung’s Exynos 2700 Using Side-by-Side RAM for Cooler, Faster Memory

Arm Stock Rebounds After Post-Earnings Slide as Licensing Miss Tempers Record Royalties

Samsung Begins Mass Production of 2nm Exynos 2600 for Galaxy S26 Pro

Samsung Preps 2nm Exynos 2600 for Mass Production as Galaxy S26 Chip Plans Take Shape

Samsung Embeds Internal Cooling Chip in Exynos 2600 for Galaxy S26