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Chip Design

AI Chips Exynos Chips Exynos 2600 HBM4 Chip Qualcomm Snapdragon X2 Elite Extreme Integrated Circuits High-Performance Processors Wafers Intellectual Property Thermal Management

Reports Split on Samsung’s Exynos 2700 Packaging Plan

The choice could determine sustained performance by changing how heat moves off the processor.

Reports Point to Samsung’s Exynos 2700 Using Side-by-Side RAM for Cooler, Faster Memory

Qualcomm Tapes Out 2nm Chip Design in India as New Semicon Push Takes Shape

Arm Stock Rebounds After Post-Earnings Slide as Licensing Miss Tempers Record Royalties

India Sets 2032 Goal for 3-Nanometre Chipmaking, Maps 2029 Milestone

Samsung Nears Nvidia Deal on HBM4 Pricing as It Targets Early 2026 Shipments

Samsung Begins Mass Production of 2nm Exynos 2600 for Galaxy S26 Pro

Samsung Preps 2nm Exynos 2600 for Mass Production as Galaxy S26 Chip Plans Take Shape

Samsung Embeds Internal Cooling Chip in Exynos 2600 for Galaxy S26