Overview
- Multiple Korea-sourced reports say Samsung may drop Fan-Out Wafer-Level Packaging, which routes chip connections outside the die to save space and spread heat, to cut costs during a DRAM shortage.
- An opposing leak claims Samsung will keep its premium packaging for the 2nm Exynos 2700, so no trade-off is finalized.
- Several outlets say Samsung could use a side-by-side layout that places the processor and RAM next to each other with heat blocks, a setup meant to spread heat and shorten the path to memory.
- Analysts warn that removing FOWLP could raise temperatures and trim sustained speed, though the side-by-side approach may soften the thermal hit.
- Rumors still point to flagship parts—Samsung’s second‑generation 2nm process, a 10‑core CPU, an AMD RDNA 5‑based Xclipse GPU, LPDDR6, and UFS 5.0—with Galaxy S27 phones expected in early 2027 and packaging plans still unsettled.