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Samsung Embeds Internal Cooling Chip in Exynos 2600 for Galaxy S26

A copper-based heatsink installed over the processor and memory promises improved thermal control ahead of mass production in late 2025.

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Overview

  • The Exynos 2600 integrates a Heat Pass Block heatsink over its application processor and DRAM alongside fan-out wafer-level packaging to maximize heat removal.
  • Built on Samsung’s 2 nm node, the chip features a deca-core CPU configuration and an Xclipse GPU co-developed with AMD for graphics performance.
  • Early 3DMark benchmarks indicate the Exynos 2600’s GPU has outpaced Qualcomm’s Snapdragon 8 Elite in graphics tests.
  • Samsung plans to finalize testing by October 2025 and begin mass production in late 2025 to supply Galaxy S26’s standard models in early 2026.
  • Higher-tier Galaxy S26 variants are expected to continue using Qualcomm’s Snapdragon 8 Elite Gen 2 for premium performance.