Particle.news
Manufacturing Processes Arm Transistor Technology Custom Chips Arm Holdings Foundry Services Nvidia Architecture Process Technology Artificial Intelligence Semiconductors Performance Metrics Apple Silicon Intel Chiplet Architecture Data Centers Exynos Chips Central Processing Units ARM Architecture Software Development Core Architecture 3nm Process Technology Exynos Series Advanced Packaging AI Hardware Development Engineering Companies Custom Cores Application-Specific Integrated Circuits System-in-Package Broadcom Silicon Technology Innovations Performance Optimization Blackwell Chips AI Models Performance Testing Fabless Companies Industry Trends Fabrication Arm Ltd Arm Technology Power Efficiency IPO British Chip Designers Qualcomm AI Chip Development Smartphones Lithography ARM Cortex-X5 Dual-Chip System CPU Manufacturing Google Accelerators Integrated Circuits Process Design Kits AI Processors NVIDIA Transistor Density Collaboration Application-Specific Integrated Circuits (ASICs) Networking Technology M-series Chips Product Development Heat Management Processors Fabrication Nodes AMD Products Modularity Mobile Processors SoCs Processor Development Apple Inc. Performance Improvement Wafer-Level Packaging Multi-Chip Packages System Architecture Transistor Architecture Advanced Micro Devices Integrated Device Manufacturer Compute Solutions US Chipmakers ASICs System on Chip (SoC) Logic Chips Advanced Processes Reference Chip Designs TSMC's SoIC Advanced Packaging Process Shortage Avoidance Arm Architecture Transistor Structures Inference Processing Chinese Chip Shop Loongson Softbank Group Fabrication Technology Manufacturing Microchips Challenges Thermal Management AI Chips AI in Chip Design
The move reflects Apple’s push for a U.S. second source at advanced nodes, contingent on Intel delivering full 18AP PDKs plus repeatable yields.
