Chip Design

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Intel Ships First High-Volume Logic Chips Made With ASML High‑NA EUV

Demonstrating production-grade yield parity on select chip layers, the move presents steep cost and deployment challenges for wider adoption.

TSMC Reportedly Plans 5–10% Price Hikes on Advanced Nodes

Credible Tipster Refutes Claim That Intel Will Make iPhone 18’s A20

ByteDance in Talks to Buy 50,000+ Inference GPUs From Iluvatar CoreX

Samsung’s Lee Visits Taiwan to Court MediaTek as a Foundry Client

TSMC Prioritizes Advanced Packaging and Pushes Back High‑NA EUV Rollout

Samsung’s 2nm Yields Still Short of Mass Production, Trail TSMC

DeepSeek’s Next AI Model to Run on Huawei Chips as Alibaba, ByteDance and Tencent Place Large Orders

Musk Pitches Terafab, a Texas AI Chip Megafab, as Analysts Warn on Costs

Nvidia Surpasses Apple as TSMC’s Largest Customer in 2026

Samsung’s 2nm Yields Steady, Lifting Prospects for Qualcomm Orders

Microsoft Launches Maia 200 AI Accelerator for Azure With Inference Focus

BE Semiconductor Industries Reports Preliminary Q4 Orders of €250 Million

SK hynix Showcases 16-Layer HBM4 and AI Memory Portfolio at CES 2026

Apple’s A20 on TSMC 2nm Reported at $280 Per Chip, an 80% Jump

Nvidia Reportedly Pauses Intel 18A Chip Tests, Knocking Intel Shares

Apple Evaluates Intel’s 2nm‑Class 18AP for Low‑End M Chips, Targeting 2027 Production

TSMC to Build Three More 2nm Fabs in Taiwan to Boost 2026 Output

Arm Tops Q2 and Raises Outlook on AI Demand for Power‑Efficient Chips

AMD, Intel Open Early Talks on Foundry Deal