BE Semiconductor Industries Reports Preliminary Q4 Orders of €250 Million

Orders were lifted by broader bookings from Asian subcontractors for 2.5D data-center packaging.

Overview

Preliminary fourth-quarter orders rose to €250 million (about $292 million), up from €174.7 million in Q3 and €128 million in Q2.
Management cited renewed capacity purchases by leading photonics customers alongside the 2.5D data-center packaging demand.
Shares gained roughly 7% in early trading after the update, with ING noting the figure was about 29% above a €194 million consensus.
The company supplies chip-assembly equipment that picks and bonds chips, serving subcontractors building hardware for designers such as Nvidia and AMD.
BESI said new orders for its advanced hybrid bonding tools contributed to the quarter, though it did not disclose their size, and the figure remains preliminary.