Intel Ships First High-Volume Logic Chips Made With ASML High‑NA EUV

Overview

• ASML said Wednesday that Intel Foundry has begun high-volume manufacture of select Intel Core Ultra Series 3 (Panther Lake) processors using High‑NA EUV to pattern specific layers.
• Those layers were dual-qualified in Oregon and are shipping to customers at yields that ASML says match the incumbent NXE EUV platform.
• High‑NA EUV increases resolution and overlay control so makers can draw smaller, denser features with fewer patterning steps, a capability important for faster and more efficient AI and laptop processors.
• The production tool in use is ASML’s second‑generation EXE:5200B, and industry reporting notes High‑NA systems are costly and complex to deploy, with per‑tool estimates around $400 million.
• The milestone moves High‑NA from R&D into commercial logic production and should accelerate optimization data gathering, but broader adoption will depend on easing tool cost, throughput and integration challenges that affect chipmakers and fab employment decisions.