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SK Hynix Launches iHBM to Embed Cooling Elements Inside HBM Packages

Silicon cooling inserts cut thermal resistance by about 30% to ease scaling of next‑generation AI memory.

Huawei Unveils Tau Scaling Law and LogicFolding, Says Path to 1.4nm‑Equivalent Chips by 2031

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Nvidia Pushes Into CPUs With Vera and Forecasts $200 Billion Market

Nvidia Reports Record Quarter and Authorizes $80 Billion Buyback With Large Dividend Hike

Taiwan Raids 12 Sites and Seeks Detention of Three Over Forged Exports of Nvidia-Powered Servers

Intel Rebounds After Five‑Day Slide as Analysts Raise Price Targets

Cerebras Stock Fueled by Institutional Buys and Fast‑Track S&P Inclusion After Volatile IPO

Nvidia Starts Shipping Vera CPU to Anthropic, OpenAI, SpaceXAI and Oracle

Cerebras Shares Fall Back After Whirlwind IPO Debut

Cerebras Soars, Then Slips, in 2026’s Biggest Tech IPO

Honor Confirms Q3 Launch for Robot Phone With Built-In Gimbal Camera

AMD Seizes Record 46% of x86 Server CPU Revenue as Data-Center Boom Lifts Outlook

Cerebras Doubles in Nasdaq Debut After $5.55 Billion AI Chip IPO

SoftBank Puts $457 Million Into Graphcore to Bolster AI Chip Ambitions

Micron Begins Sampling 256GB DDR5 RDIMMs Rated Up to 9,200 MT/s

AI Memory Crunch Deepens as Prices Soar and Shortage Timeline Extends to 2028

Cerebras Lifts IPO Range to $150–$160 and Expands Sale to 30 Million Shares

AI Boom Powers Breakneck Rally Across Chip Stocks as SOX Jumps 50%

Lumentum Soars On Nasdaq-100 Entry And Fresh Analyst Upgrades

SK Hynix Begins Testing Intel EMIB for HBM Packaging to Ease CoWoS Strain