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U.S. Drafts Tiered AI Chip Export Rules Linking Mega Shipments to U.S. Investment

Commerce has circulated a proposal for interagency review to codify Middle East–style commitments tied to very large accelerator deals.

U.S. Weighs 75,000-Unit Cap on China AI Chips as Nvidia Shifts H200 Production

Samsung Shares Hit Record on Reports of $700 HBM4 Pricing and Premium Nvidia Tier

Samsung’s HBM4 Leads Nvidia’s Late-Stage Tests for Rubin as Contract Decisions Near

Samsung and SK hynix Put HBM4 on Display at SEDEX as Next AI Memory Race Accelerates

Intel’s 2025 Rally Tested by Bank of America Downgrade

Samsung Reportedly Clears Nvidia’s HBM3E Qualification, Turbocharging Shares and the Memory Outlook

Samsung Passes Nvidia's HBM3E Quality Test, Joining the Supply Chain

Intel Unveils Arc Pro B50 and B60 GPUs for Workstations and AI at Computex 2025