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CXMT Announces LPDDR6 Mass Production for Xiaomi as HBM3E Risk Production Starts

The moves show rapid technical progress that still faces constrained volumes, low yields and restricted access to EUV lithography.

SK hynix and SanDisk Publish Open HBF Standard as Samsung Shows Competing zHBM

AMD's Push to Lead AI Infrastructure Faces Packaging and Memory Limits

SK hynix Announces iHBM, Embeds Cooling Elements Inside HBM Packages

SK Hynix Begins Testing Intel EMIB for HBM Packaging to Ease CoWoS Strain

Rebellions Raises $400 Million in Pre-IPO Round Led by Mirae Asset and Korea Growth Fund

AMD in Talks to Supply 10,000 MI355 AI Chips to South Korea’s Upstage

U.S. Drafts Tiered AI Chip Export Rules Linking Mega Shipments to U.S. Investment

U.S. Weighs 75,000-Unit Cap on China AI Chips as Nvidia Shifts H200 Production

Samsung Shares Hit Record on Reports of $700 HBM4 Pricing and Premium Nvidia Tier

Samsung’s HBM4 Leads Nvidia’s Late-Stage Tests for Rubin as Contract Decisions Near

Samsung and SK hynix Put HBM4 on Display at SEDEX as Next AI Memory Race Accelerates

Intel’s 2025 Rally Tested by Bank of America Downgrade

Samsung Reportedly Clears Nvidia’s HBM3E Qualification, Turbocharging Shares and the Memory Outlook

Samsung Passes Nvidia's HBM3E Quality Test, Joining the Supply Chain

Intel Unveils Arc Pro B50 and B60 GPUs for Workstations and AI at Computex 2025