Thermal design power, also known as thermal design point, is the maximum amount of heat that a computer component can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock rate. From Wikipedia
Unverified leaks detail three Ryzen Pro 9000 SKUs, a discrete-GPU-only 9700F model; doubts are growing over whether Ryzen 9000G APUs will feature Zen 5 silicon
