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Leaks Suggest AMD’s Next Ryzen 9000 CPUs Could Double 3D V-Cache

A prominent hardware leaker on X reports that AMD’s Zen 5 chips could stack two X3D dies for up to 192 MB of L3 cache, pending official confirmation.

An image about AMD rumored with new Ryzen 9000 CPU: 16C/32T, 200W TDP, huge 192MB L3 cache, dual X3D cache
AMD CPUs could be about to get double this key feature for gaming performance
Ryzen 9000 CPU

Overview

  • Leaked posts from user chi11eddog outline two upcoming Ryzen 9000 “Zen 5” desktop CPUs in 8-core/16-thread and 16-core/32-thread configurations.
  • The rumored 16-core variant would employ dual X3D cache dies to achieve 192 MB of L3 cache at a 200 W TDP, a first for AMD’s mainstream Ryzen lineup.
  • The companion 8-core model is said to pack 96 MB of L3 cache with a 120 W power limit, echoing the cache boost of current X3D-equipped chips.
  • AMD has previously ruled out dual 3D V-Cache designs as too expensive and offering minimal gaming gains, and it has not verified these new specifications.
  • All details remain speculative until AMD confirms the designs or announces a release, leaving performance gains and pricing undetermined.