Technology ❯ Hardware ❯ Manufacturing

Supply Chain

TSMC Pricing Strategies India Tariffs Apple Inc. Component Supply Consumer Devices Microsoft Surface China AI Hardware Component Suppliers Foxconn Component Costs Negotiations Production Capacity

8 ARTICLES

last mo.

Hot Chips Shows Memory Wall Deepening as HBM Packaging Hits Physical Limits

Vendors say compute is outpacing HBM bandwidth and that thermal and thickness constraints are forcing near‑term fixes while advanced copper bonding is postponed to a later HBM generation.

12 ARTICLES

11mo ago

Report: Microsoft, AWS and Google Plan to Move Hardware and Server Production Out of China by 2026