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Manufacturing

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8 ARTICLES

last mo.

Hot Chips Shows Memory Wall Deepening as HBM Packaging Hits Physical Limits

Vendors say compute is outpacing HBM bandwidth and that thermal and thickness constraints are forcing near‑term fixes while advanced copper bonding is postponed to a later HBM generation.

11 ARTICLES

last mo.

Intel Keeps Raptor Lake and DDR4 Support as Nova Lake Is Slated for Desktop First

4 ARTICLES

last mo.

Report: Microsoft, AWS and Google Plan to Move Hardware and Server Production Out of China by 2026

3 ARTICLES

last yr.

Xiaomi's XRING 01 Benchmarked Ahead of Launch, Showcasing Competitive Decacore Design

Manufacturing

Hot Chips Shows Memory Wall Deepening as HBM Packaging Hits Physical Limits

Intel Keeps Raptor Lake and DDR4 Support as Nova Lake Is Slated for Desktop First

Noctua Finds More Than Half of PC Case Cooler‑Clearance Specs Are Inaccurate

Samsung’s Fold 8 Lineup Clears US Certification as Leaks Point to Higher Prices

Leaks Point to Two-Tier Snapdragon 8 Elite Gen 6 Built on TSMC’s 2nm

Report: Microsoft, AWS and Google Plan to Move Hardware and Server Production Out of China by 2026

Xiaomi's XRING 01 Benchmarked Ahead of Launch, Showcasing Competitive Decacore Design