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Samsung Ships World’s First 12‑Layer HBM4E Samples

Samsung sent sample chips to customers to start qualification so it can scale mass production on customer timetables and compete for AI memory contracts.

Peking University Unveils Prototype 3D EDA for Huawei’s LogicFolding Push

Alibaba Unveils Zhenwu M890 Chip to Power Long‑Running AI Agents

Samsung’s 4nm Chip Yields Top 80%, Signaling Mature Production

TSMC’s 2nm Lines Are Booked Into 2028, Pushing Big Chip Orders Toward Samsung

Samsung Starts Mass Production and Shipments of HBM4 Memory

Reports Point to Exynos 2700 Mass Production in H2 2026, Bigger Role in Galaxy S27

Samsung Set to Start HBM4 Mass Production and Ship to Nvidia This Month

Nvidia’s China H200 Exports Still Stalled as U.S. Presses Strict KYC Terms

China Approves First Batch of Nvidia H200 AI Chips for Internet Giants

Nvidia Overtakes Apple as TSMC’s Biggest Customer, Reshaping Chipmaking Priorities

Apple’s A20 on TSMC 2nm Reported at $280 Per Chip, an 80% Jump

Samsung’s HBM4 Leads Nvidia’s Late-Stage Tests for Rubin as Contract Decisions Near

Samsung and SK hynix Put HBM4 on Display at SEDEX as Next AI Memory Race Accelerates