Overview
- Both companies showcased next‑generation HBM4 chips at the SEDEX trade show in Seoul on Oct. 22, signaling progress toward the new memory node.
- SK hynix says it has completed development and is preparing for mass production, and reports indicate it is in talks with Nvidia for large‑scale supply.
- Samsung exhibited its HBM4 as part of a push to regain share, with industry reporting citing roughly 90% logic‑die yields that would support a near‑term ramp.
- Samsung plans additional disclosures at its Oct. 27–31 Tech Fair, where local reports say a 12‑layer part slated for mass production later this year will be highlighted.
- Industry watchers expect HBM4 to power Nvidia’s Rubin accelerator next year, as the current market shows SK hynix leading Q2 HBM shipments at 62% versus Micron at 21% and Samsung at 17%.