TSMC 3nm Process Technology Chip Production 3nm Process Lithography Intel Investment Advanced Packaging GlobalFoundries Chip Design Taiwan Semiconductor Manufacturing Company Wafer Production Nexperia Qubit Fabrication Materials Memory Production SMIC Facilities Outsourced Assembly Fabs Semiconductor Fabs Computer Chips Flexible Fibres Advanced Packaging Substrates TSMC's Capabilities Locations Future Adoption Packaging Facility CHIPS Act TSMC 4N Node TSMC N3B Intel Corp. Taiwan Semiconductor Manufacturing Co Taiwan Semiconductor Manufacturing Company (TSMC) Taiwan Semiconductor Manufacturing Co. Microchips Chip Development ASML Lithography Equipment Silicon Fabrication 5nm Process 3nm Technology Lithography Process Wafer Processing Joint Ventures NAND Production Wafer Technology Domestic Production High-End Chips EU Industry 4nm Process Rare-Earth Elements DRAM Production AI Factories Fabrication Processes Samsung Foundry AI in Manufacturing Fab Facilities Design Automation Packaging 18A Process Equipment 2nm Process Advanced Technology Global Expansion TeraFab Advanced Chip Machines Cost Efficiency Advanced Packaging Technologies Foundry Process Nodes Wafer Manufacturing Process Technology Chinese Foundries Chipmaking EUV Lithography Patterning Techniques Microcontroller Units
The foundry has notified authorities of a NT$900 billion buildout to scale advanced capacity for AI‑era chips.