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Peking University Unveils Prototype 3D EDA for Huawei’s LogicFolding Push

The development shows China pursuing 3D stacking and domestic design tools to try to close the chip gap created by export limits.

Reports Split on Samsung’s Exynos 2700 Packaging Plan

Intel Courts Google and Amazon for AI Chip Packaging as EMIB-T Nears Production

Reports Point to Exynos 2700 Mass Production in H2 2026, Bigger Role in Galaxy S27

China Customs Hold Leaves Nvidia H200 Shipments in Limbo After U.S. Clearance

SK Hynix Pulls Forward Yongin Fab to Feb. 2027, Sets HBM Wafer Starts in Cheongju Next Month

Samsung Begins Mass Production of ISOCELL HP5, a 200MP Phone Sensor With 0.5µm Pixels

Trump Says Chip Import Tariffs Coming ‘Very Shortly’ for Firms Without U.S. Production

Samsung Confirms Exynos 2600 as First 2nm GAA Smartphone Chip

TUM Unveils AI Pro, a Brain-Inspired Chip for Secure, Energy-Efficient Edge AI