Semiconductor Manufacturing

Investment Samsung Electronics Samsung Research and Development Pricing Strategies Partnerships Supply Chain TSMC Foundries Apple Inc.

3 ARTICLES

3w ago

SK Hynix Flags 2027 as Memory Industry’s Worst Year After $26.5 Billion Nasdaq IPO

AI-driven demand for high-bandwidth memory is using disproportionate wafer capacity and locking suppliers into long-term deals that will keep consumer RAM tight despite planned expansions.

6 ARTICLES

3w ago

Reports Point to Exynos 2700 Mass Production in H2 2026, Bigger Role in Galaxy S27

10 ARTICLES

6mo ago

China Customs Hold Leaves Nvidia H200 Shipments in Limbo After U.S. Clearance

7 ARTICLES

6mo ago

SK Hynix Pulls Forward Yongin Fab to Feb. 2027, Sets HBM Wafer Starts in Cheongju Next Month

8 ARTICLES

9mo ago

Samsung Begins Mass Production of ISOCELL HP5, a 200MP Phone Sensor With 0.5µm Pixels

3 ARTICLES

10mo ago

Samsung Set to Begin 2‑Nm Exynos 2600 Mass Production in September

14 ARTICLES

11mo ago

Trump Says Chip Import Tariffs Coming ‘Very Shortly’ for Firms Without U.S. Production

9 ARTICLES

last yr.

Samsung Confirms Exynos 2600 as First 2nm GAA Smartphone Chip

4 ARTICLES

last yr.

TUM Unveils AI Pro, a Brain-Inspired Chip for Secure, Energy-Efficient Edge AI

9 ARTICLES

last yr.

Microsoft Urges Trump Administration to Revise AI Chip Export Rules

7 ARTICLES

last yr.

Biden Administration Invests $825 Million in Albany Semiconductor R&D Facility

3 ARTICLES

last yr.

Intel Reveals Clearwater Forest Chips Based on Advanced 18A Node

3 ARTICLES

last yr.

TSMC to Install First High-NA EUV Lithography Machine This Month

3 ARTICLES

last yr.

SK hynix and Samsung Race to Develop Next-Gen HBM4 Memory

Semiconductor Manufacturing

SK Hynix Flags 2027 as Memory Industry’s Worst Year After $26.5 Billion Nasdaq IPO

Samsung Reportedly Developing 4nm Arm AI Accelerator 'Gaia' for PCs

Samsung Pushes for Another 20% DRAM and LPDDR Price Hike in Q3 2026

Peking University Unveils Prototype 3D EDA for Huawei’s LogicFolding Push

White House Approves $9 Billion Secret AI Compute Plan for Spy Agencies

Reports Split on Samsung’s Exynos 2700 Packaging Plan

Intel Courts Google and Amazon for AI Chip Packaging as EMIB-T Nears Production

Reports Point to Exynos 2700 Mass Production in H2 2026, Bigger Role in Galaxy S27

China Customs Hold Leaves Nvidia H200 Shipments in Limbo After U.S. Clearance

SK Hynix Pulls Forward Yongin Fab to Feb. 2027, Sets HBM Wafer Starts in Cheongju Next Month

Never miss stories about

Semiconductor Manufacturing

Samsung Begins Mass Production of ISOCELL HP5, a 200MP Phone Sensor With 0.5µm Pixels

Samsung Set to Begin 2‑Nm Exynos 2600 Mass Production in September

Trump Says Chip Import Tariffs Coming ‘Very Shortly’ for Firms Without U.S. Production

Samsung Confirms Exynos 2600 as First 2nm GAA Smartphone Chip

TUM Unveils AI Pro, a Brain-Inspired Chip for Secure, Energy-Efficient Edge AI

Microsoft Urges Trump Administration to Revise AI Chip Export Rules

Biden Administration Invests $825 Million in Albany Semiconductor R&D Facility

Intel Reveals Clearwater Forest Chips Based on Advanced 18A Node

TSMC to Install First High-NA EUV Lithography Machine This Month

SK hynix and Samsung Race to Develop Next-Gen HBM4 Memory

Never miss stories about

Semiconductor Manufacturing