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CXMT Announces LPDDR6 Mass Production for Xiaomi as HBM3E Risk Production Starts

The moves show rapid technical progress that still faces constrained volumes, low yields and restricted access to EUV lithography.

China Tightens Legal Protections for Chip Layout Designs

TSMC Moves to Copy Intel’s EMIB as Packaging Bottleneck Chokes AI Chip Supply

Samsung Reportedly May Outsource Back-End Design for Google’s Next TPU

Samsung Reportedly Developing 4nm Arm AI Accelerator 'Gaia' for PCs

Samsung Pushes for Another 20% DRAM and LPDDR Price Hike in Q3 2026

Peking University Unveils Prototype 3D EDA for Huawei’s LogicFolding Push

Reports Split on Samsung’s Exynos 2700 Packaging Plan

Intel Courts Google and Amazon for AI Chip Packaging as EMIB-T Nears Production

Reports Point to Exynos 2700 Mass Production in H2 2026, Bigger Role in Galaxy S27

China Customs Hold Leaves Nvidia H200 Shipments in Limbo After U.S. Clearance

SK Hynix Pulls Forward Yongin Fab to Feb. 2027, Sets HBM Wafer Starts in Cheongju Next Month

Samsung Begins Mass Production of ISOCELL HP5, a 200MP Phone Sensor With 0.5µm Pixels

Trump Says Chip Import Tariffs Coming ‘Very Shortly’ for Firms Without U.S. Production

Samsung Confirms Exynos 2600 as First 2nm GAA Smartphone Chip

TUM Unveils AI Pro, a Brain-Inspired Chip for Secure, Energy-Efficient Edge AI