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Micron Pauses Taoyuan DRAM Fab 11E Construction

Unresolved talks over the Taoyuan union’s large bonus and profit‑sharing demands could slow Micron’s ability to expand AI memory supply.

CXMT to Begin Limited HBM3E Output Despite Very Low Yields

TSMC Weighs Up to 20% CoWoS Price Hike as Advanced Packaging Stays Tight

Sony Reported to Hold Priority Access to AMD’s RDNA 5 for Rumored PS6 Handheld

AMD Revived Ryzen 7 5800X3D as a ‘Final Gift’ for AM4 Owners

Samsung Secures Most 2027 Memory Supply as Nvidia Backs Substrate Buildout

Nvidia Says RTX 5090 Will Keep Shipping as Card Vanishes From Its U.S. Store

Micron Posts Record Year as AI Demand Drives Prices, Margins and Backlog

Explosion and Fire at Intel Kiryat Gat Plant Kill Two and Severely Injure Workers

Nvidia Reportedly Stops RTX 5090 Production to Reserve Blackwell Chips for AI and Pro Cards

IonQ to Buy Zero‑Trust Firm Elisity in Up to $1.3 Billion All‑Stock Deal

CXMT Announces LPDDR6 Mass Production for Xiaomi as HBM3E Risk Production Starts

China Tightens Legal Protections for Chip Layout Designs

TSMC Moves to Copy Intel’s EMIB as Packaging Bottleneck Chokes AI Chip Supply

Samsung Reportedly May Outsource Back-End Design for Google’s Next TPU

Samsung Reportedly Developing 4nm Arm AI Accelerator 'Gaia' for PCs

Samsung Pushes for Another 20% DRAM and LPDDR Price Hike in Q3 2026

Peking University Unveils Prototype 3D EDA for Huawei’s LogicFolding Push

White House Approves $9 Billion Secret AI Compute Plan for Spy Agencies

Reports Split on Samsung’s Exynos 2700 Packaging Plan