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Intel Ships First High-Volume Logic Chips Made With ASML High‑NA EUV

Demonstrating production-grade yield parity on select chip layers, the move presents steep cost and deployment challenges for wider adoption.

Intel Considers Dual‑Sided Power Delivery for 14A2 to Solve 21nm Interconnect Limits

TSMC Stakes U.S. Packaging Push as AI Demand Tightens Capacity

Applied Materials Unveils Two 3D Chip Tools as Stock Holds Multi‑Month Highs

Korean Unions Push Profit-Linked Bonuses as Samsung Strike Threat Looms

ByteDance, Alibaba Poised to Order Huawei's 950PR AI Chip, Sources Say

China Rejects U.S. Allegation That SMIC Sent Chip Tools to Iran’s Military

AI Demand Tightens Memory Supply, Lifting Micron and Sandisk

ASML Validates 1,000‑W EUV Light Source, Targeting 50% Higher Wafer Throughput by 2030

South Korea's January Exports Hit Record on AI-Driven Chip Surge

Tesla Revives Dojo 3 as Musk Says AI5 Design Nears Finish, Sets Nine‑Month Chip Cadence

China Announces First Domestic High-Energy Hydrogen Ion Implanter, POWER-750H

China Assembles EUV Chipmaking Prototype in Shenzhen, Reuters Reports

Netherlands Suspends Nexperia Order to Return Control to Wingtech

Nvidia Rules Out China Sales for Blackwell as Strong Demand Spurs TSMC Ramp

Nvidia and TSMC Make First U.S.-Built Blackwell Wafer at Arizona Fab

China’s Yunqifang Unveils Two Domestic EDA Tools as Washington Threatens New Controls

AMD, Intel Open Early Talks on Foundry Deal

Samsung Starts Mass Production of 2nm Exynos 2600 for Galaxy S26

India’s First Telecom System Using India-Made Chips Wins TEC Certification