Overview
- TSMC fabricated the first production Nvidia Blackwell wafer at Fab 21 near Phoenix, marking a notable onshore step for advanced AI chips.
- The wafer will be sent to Taiwan for advanced packaging and final testing before becoming a finished product, leaving cross-border dependencies in place.
- Nvidia CEO Jensen Huang hailed the moment at the Arizona event, describing it as a landmark for American chip manufacturing.
- Reporting frames the achievement as evidence that U.S. incentives have begun yielding concrete results after years of reliance on overseas fabrication.
- TSMC signals continued Arizona expansion, while industry plans for U.S.-based advanced packaging are in development, suggesting full localization remains several years away.