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ASML Validates 1,000‑W EUV Light Source, Targeting 50% Higher Wafer Throughput by 2030

A dual‑pulse, high‑rate tin‑droplet method now puts pressure on suppliers of optics, debris control, resists, pellicles.

Wolfspeed Secures $698.6 Million CHIPS Tax Refund After Bankruptcy Exit

Nürburgring Certifies Yangwang U9 Xtreme’s 6:59.157, Setting New EV Production Lap Record

UMass Amherst Renames Engineering College After $50 Million Gift From Apple Veteran Daniel Riccio

Crunchyroll Overhauls Operations With Undisclosed Layoffs and New Engineering Hubs