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Thermal Management

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Huawei Opens Pre-Orders for Mate 80 Pro Max Wind Edition With Built-In Camera-Bump Fan

Pre-orders in China confirm a vented camera ring housing an internal fan, with full specifications due on March 23.

Ecolab Is Said to Near $4.5 Billion–$5 Billion Deal for CoolIT

Frore Systems Raises $143 Million, Hits $1.64 Billion Valuation on AI Cooling Push

Leak Points to Qualcomm Testing 5GHz Cores, Exploring Samsung HPB Cooling for Snapdragon 8 Elite Gen 6

NASA Completes SLS Fueling Rehearsal as Chinese Firms Report Propulsion Gains

Nvidia’s Vera Rubin Hot-Water Cooling Rattles Data-Center HVAC Stocks

YPlasma to Debut DBD Plasma Cooling Film for Laptops at CES 2026

Sony Quietly Revises PS5 Slim Cooling With PS5 Pro-Style Grooved Heatsink

Independent Test Backs Hydrohertz Dectravalve, Pointing to Up to 68% Faster EV Fast‑Charging

RedMagic 11 Pro Debuts in China With Visible Liquid Cooling

Microsoft Unveils On‑Chip Microfluidic Cooling Over Silicon, Claiming Triple Efficiency

Samsung Preps 2nm Exynos 2600 for Mass Production as Galaxy S26 Chip Plans Take Shape

Mercedes‑AMG GT XX Sets 24‑Hour EV Distance Record and Completes 40,075‑Kilometer Endurance Run

Peak Energy Deploys First U.S. Grid-Scale Sodium-Ion Battery in Nine-Utility Pilot

Samsung Embeds Internal Cooling Chip in Exynos 2600 for Galaxy S26

BMW M4 Radiator Setup Reaches 4.9 GHz on AMD’s 96-Core Threadripper Pro

NVIDIA Envisions Future AI Chips with 3D GPU Stacking and Silicon Photonics

Apple's New M4 Mac Mini Features User-Upgradeable Storage

Revolutionary Micro-Cooling Chip to Enhance AI-Driven Mobile Devices