Technology ❯ Engineering

Thermal Management

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Apple Reportedly Boosts Vapor‑Chamber Orders for Rumored Foldable and Anniversary iPhones

If true, the move would signal a larger production ramp to manage heat in much tighter foldable and edge‑to‑edge phone designs.

Sony Patent Suggests Vapor Heat‑Pipe Cooling Instead of PS5’s Liquid Metal

SK hynix Announces iHBM, Embeds Cooling Elements Inside HBM Packages

Vertiv Pushes Into Liquid Cooling for AI Data Centers

Vertiv Deepens AI Data‑Center Push With Liquid‑Cooling Deal and Big‑Build Roles

YouTuber’s 15-Fan ‘Superdome’ Side Panel Cuts CPU Temps by About 20°C

Huawei Opens Pre-Orders for Mate 80 Pro Max Wind Edition With Built-In Camera-Bump Fan

Ecolab Is Said to Near $4.5 Billion–$5 Billion Deal for CoolIT

Frore Systems Raises $143 Million, Hits $1.64 Billion Valuation on AI Cooling Push

VTT Reports Donut Lab Battery Delivers Higher Measured Capacity at 80–100°C and Survives 100°C Discharge

Leak Points to Qualcomm Testing 5GHz Cores, Exploring Samsung HPB Cooling for Snapdragon 8 Elite Gen 6

NASA Completes SLS Fueling Rehearsal as Chinese Firms Report Propulsion Gains

Nvidia’s Vera Rubin Hot-Water Cooling Rattles Data-Center HVAC Stocks

YPlasma to Debut DBD Plasma Cooling Film for Laptops at CES 2026

Sony Quietly Revises PS5 Slim Cooling With PS5 Pro-Style Grooved Heatsink

Independent Test Backs Hydrohertz Dectravalve, Pointing to Up to 68% Faster EV Fast‑Charging

RedMagic 11 Pro Debuts in China With Visible Liquid Cooling

Microsoft Unveils On‑Chip Microfluidic Cooling Over Silicon, Claiming Triple Efficiency

Samsung Preps 2nm Exynos 2600 for Mass Production as Galaxy S26 Chip Plans Take Shape

Mercedes‑AMG GT XX Sets 24‑Hour EV Distance Record and Completes 40,075‑Kilometer Endurance Run