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Thermal Management

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Leak Points to Qualcomm Testing 5GHz Cores, Exploring Samsung HPB Cooling for Snapdragon 8 Elite Gen 6

A fresh tip suggests Qualcomm is evaluating Samsung’s copper-on-die HPB approach to cope with the thermal demands of next‑gen performance targets.

Nvidia’s Vera Rubin Hot-Water Cooling Rattles Data-Center HVAC Stocks

YPlasma to Debut DBD Plasma Cooling Film for Laptops at CES 2026

Sony Quietly Revises PS5 Slim Cooling With PS5 Pro-Style Grooved Heatsink

Independent Test Backs Hydrohertz Dectravalve, Pointing to Up to 68% Faster EV Fast‑Charging

RedMagic 11 Pro Debuts in China With Visible Liquid Cooling

Samsung Preps 2nm Exynos 2600 for Mass Production as Galaxy S26 Chip Plans Take Shape

Peak Energy Deploys First U.S. Grid-Scale Sodium-Ion Battery in Nine-Utility Pilot

Samsung Embeds Internal Cooling Chip in Exynos 2600 for Galaxy S26

BMW M4 Radiator Setup Reaches 4.9 GHz on AMD’s 96-Core Threadripper Pro