Technology ❯ Engineering

Thermal Management

Cooling Systems Cooling Solutions Heat Dissipation Heat Transfer Cooling Technologies Liquid Cooling Battery Systems Thermal Systems Active Cooling Phase Change Cooling Solid-State Technology Processor Technology Overclocking Chip Performance Vapor Chambers Material Innovation Cooling Efficiency Heat Pass Block Thermal Paste Battery Cooling Systems Airflow Thermal Analysis Heat Sinks High-Temperature Materials Cold-Plate Design Adaptive Coatings Chip Design Airflow Dynamics Phase Change Technology Microfluidics

SK hynix Announces iHBM, Embeds Cooling Elements Inside HBM Packages

The packaging change creates a direct thermal path inside stacked memory to cut hotspots and reduce performance throttling in dense AI systems.

Vertiv Pushes Into Liquid Cooling for AI Data Centers

Vertiv Deepens AI Data‑Center Push With Liquid‑Cooling Deal and Big‑Build Roles

YouTuber’s 15-Fan ‘Superdome’ Side Panel Cuts CPU Temps by About 20°C

Huawei Opens Pre-Orders for Mate 80 Pro Max Wind Edition With Built-In Camera-Bump Fan

Ecolab Is Said to Near $4.5 Billion–$5 Billion Deal for CoolIT

Frore Systems Raises $143 Million, Hits $1.64 Billion Valuation on AI Cooling Push

Leak Points to Qualcomm Testing 5GHz Cores, Exploring Samsung HPB Cooling for Snapdragon 8 Elite Gen 6

Nvidia’s Vera Rubin Hot-Water Cooling Rattles Data-Center HVAC Stocks

YPlasma to Debut DBD Plasma Cooling Film for Laptops at CES 2026

Sony Quietly Revises PS5 Slim Cooling With PS5 Pro-Style Grooved Heatsink

Independent Test Backs Hydrohertz Dectravalve, Pointing to Up to 68% Faster EV Fast‑Charging

RedMagic 11 Pro Debuts in China With Visible Liquid Cooling

Samsung Preps 2nm Exynos 2600 for Mass Production as Galaxy S26 Chip Plans Take Shape

Peak Energy Deploys First U.S. Grid-Scale Sodium-Ion Battery in Nine-Utility Pilot

Samsung Embeds Internal Cooling Chip in Exynos 2600 for Galaxy S26

BMW M4 Radiator Setup Reaches 4.9 GHz on AMD’s 96-Core Threadripper Pro