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Onsemi Unveils Embedded Power Platform That Uses the Wafer as the Package

The wafer-level design packs silicon, SiC, GaN, including multiple power dies, into a single structure to raise power density for AI racks and EVs.

Arizona Manager Sentenced After Plea in Semiconductor Trade-Secret Case

Besi Q1 Orders More Than Double on AI Packaging Demand

SK Hynix Files Record $8 Billion Order for ASML EUV Tools for 2027 Delivery

ASML Slides Over Past Month as TD Cowen Reaffirms Buy Rating and €1,500 Target

Applied Materials Heads Into Q1 Earnings With $6.85 Billion Revenue Guide

IonQ Claims 99.99% Two-Qubit Gate Fidelity in New Papers, Sending Shares Higher