Overview
- Onsemi, which announced EPP on Wednesday, said sampling to strategic customers will begin in 2026 and named Subaru as an early engagement partner receiving engineering samples and models.
- EPP treats the silicon wafer itself as the package and embeds FETs, drivers and controllers while mixing silicon, silicon carbide (SiC) and gallium nitride (GaN) for wafer-level co-design.
- Onsemi reports 3–5x higher power density across applications and cites up to 4x density with about 15% lower power losses for EV inverters, and it presented an EPP-based circuit-breaker example about 50% smaller and 20% cooler than existing designs.
- Independent laboratory validation and broad customer qualification have not yet occurred, so the company’s performance claims remain vendor-reported and will require automotive-grade testing before production use.
- If validated, EPP could let data centers fit more compute per rack and allow automakers to shrink inverter size and speed development, but adoption will depend on long automotive qualification cycles and scaling wafer-level manufacturing.