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SK hynix Announces iHBM, Embeds Cooling Elements Inside HBM Packages

The packaging change creates a direct thermal path inside stacked memory to cut hotspots and reduce performance throttling in dense AI systems.

POET Raises $400 Million and Secures Lumilens Pact to Speed AI Photonics Push

TSMC Extends Lead in AI Chips With Record Margins and Higher 2026 Targets

AMD Shares Jump on Meta’s 6GW AI Pact and New AI Chips, Ecosystem Investments

Intel Rallies on Reports Apple Is Testing Its 18A Node for Future M Chips

Intel’s 2025 Rally Tested by Bank of America Downgrade

Samsung Lands $16.5 Billion Tesla Chip Deal as TSMC’s AI Foundry Grip Holds