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Semiconductor Industry

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3 ARTICLES

last wk.

Micron Posts Blockbuster Quarter and Commits $27 Billion to Expand Memory Capacity

The company’s huge Q3 results have locked in HBM sales through 2027–28 and given near‑term revenue clarity while creating execution and timing risk for its rapid buildout.

6 ARTICLES

2w ago

Applied Materials Expands AI-Focused 3D Chip Toolset and Raises Outlook

6 ARTICLES

last mo.

Fire and Hydrogen Fluoride Leak Evacuate 3,600 at SK Hynix Cheongju Plant

9 ARTICLES

last mo.

NITI Aayog Roadmap Recommends India Shift From Cutting‑Edge Fabs to Advanced Packaging and Design

4 ARTICLES

last mo.

Cyient Semiconductors Secures $30 Million Financing at $500 Million Valuation

5 ARTICLES

2mo ago

U.S. Orders Toolmakers to Halt Some Shipments to China’s Hua Hong

6 ARTICLES

2mo ago

Global DRAM Shortage Set to Stretch Into 2027 as Supply Covers Only 60% of Demand

11 ARTICLES

2mo ago

ASML Validates 1,000‑W EUV Light Source, Targeting 50% Higher Wafer Throughput by 2030

7 ARTICLES

4mo ago

Palliser Presses Toto to Highlight Underpriced Chip‑Ceramics Business

9 ARTICLES

4mo ago

Applied Materials Raises Outlook on AI-Fueled Demand; Shares Jump

9 ARTICLES

5mo ago

India Targets 7nm by 2030, 3nm by 2032 as ISM 2.0 Plans Support for 50 Chip Startups

5 ARTICLES

5mo ago

India Sets 2032 Goal for 3-Nanometre Chipmaking, Maps 2029 Milestone

9 ARTICLES

5mo ago

U.S.–Taiwan Chip Pact Cuts Tariffs and Pledges $500 Billion Toward U.S. Production

7 ARTICLES

6mo ago

Micron Soars to Record as AI HBM Shortage Locks In Sales Through 2026

Semiconductor Industry

Micron Posts Blockbuster Quarter and Commits $27 Billion to Expand Memory Capacity

Applied Materials Expands AI-Focused 3D Chip Toolset and Raises Outlook

Fire and Hydrogen Fluoride Leak Evacuate 3,600 at SK Hynix Cheongju Plant

NITI Aayog Roadmap Recommends India Shift From Cutting‑Edge Fabs to Advanced Packaging and Design

Cyient Semiconductors Secures $30 Million Financing at $500 Million Valuation

U.S. Orders Toolmakers to Halt Some Shipments to China’s Hua Hong

Global DRAM Shortage Set to Stretch Into 2027 as Supply Covers Only 60% of Demand

India Breaks Ground on First 3D Glass Chip Packaging Plant in Odisha

Delhi Drafts Semiconductor Policy Focused on Design, R&D and Packaging

Kaynes OSAT in Sanand Begins Production After Modi Inauguration

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Semiconductor Industry

AI Buildout Supercharges China’s Chip Industry at Semicon China

India to Expand Chip-Design Training to 500 Institutions Under ISM 2.0

Cornell Team Visualizes Atomic ‘Mouse Bite’ Defects Inside 3D Transistors

ASML Validates 1,000‑W EUV Light Source, Targeting 50% Higher Wafer Throughput by 2030

Palliser Presses Toto to Highlight Underpriced Chip‑Ceramics Business

Applied Materials Raises Outlook on AI-Fueled Demand; Shares Jump

India Targets 7nm by 2030, 3nm by 2032 as ISM 2.0 Plans Support for 50 Chip Startups

India Sets 2032 Goal for 3-Nanometre Chipmaking, Maps 2029 Milestone

U.S.–Taiwan Chip Pact Cuts Tariffs and Pledges $500 Billion Toward U.S. Production

Micron Soars to Record as AI HBM Shortage Locks In Sales Through 2026

Never miss stories about

Semiconductor Industry