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Semiconductor Companies

Nvidia TSMC Samsung Samsung Electronics Competition Intel Qualcomm Market Impact NVIDIA Market Competition

Intel Signals Possible Return to Memory With Talk of 3D Stacking and a Major Hire

The shift would aim to ease AI data‑center memory bottlenecks by placing memory closer to processors.

TSMC Moves to Copy Intel’s EMIB as Packaging Bottleneck Chokes AI Chip Supply

Memory Giants Drop In‑House CXL Controller Projects

Intel Ships First High-Volume Logic Wafers Made with ASML High NA EUV

U.S. Closes Loophole on Nvidia and AMD AI Chip Exports

SK hynix Announces iHBM, Embeds Cooling Elements Inside HBM Packages

Huawei Unveils Tau Scaling Law and LogicFolding, Sees Path to 1.4nm‑Equivalent Chips by 2031

Samsung’s 2nm Yields Still Short of Mass Production, Trail TSMC

Intel Joins Musk’s Terafab to Build U.S. AI Chip Capacity

Intel Courts Google and Amazon for AI Chip Packaging as EMIB-T Nears Production

Qualcomm CEO Sets Two-Year Timeline for Robotics to Become Major Business

SK hynix Showcases 16-Layer HBM4 and AI Memory Portfolio at CES 2026

Apple’s A20 on TSMC 2nm Reported at $280 Per Chip, an 80% Jump

TSMC to Build Three More 2nm Fabs in Taiwan to Boost 2026 Output

Reports Link Qualcomm, MediaTek to TSMC’s N2P as Snapdragon 8 Elite Gen 6 Is Rumored in Two Tiers

Globalfoundries Launches €1.1 Billion Dresden Expansion to Reach 1.1 Million Wafers by 2028

Samsung and SK hynix Put HBM4 on Display at SEDEX as Next AI Memory Race Accelerates

TSMC’s 2nm Draws Roughly 15 Design Customers as HPC Leads Early Demand

Samsung Passes Nvidia's HBM3E Quality Test, Joining the Supply Chain

ASML Explores India Market, Rules Out Local Manufacturing and R&D for Now