Market Competition

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Samsung Delays Full High‑NA EUV Rollout to Its 1nm Node

The company says immature mask, pellicle and materials supply chains and the very high cost of ASML’s tools make it sensible to use existing 0.33‑NA EUV with multi‑patterning for the next two nodes.

3 ARTICLES

2mo ago

ASML Validates 1,000‑W EUV Light Source, Targeting 50% Higher Wafer Throughput by 2030

7 ARTICLES

7mo ago

SK Hynix Pulls Forward Yongin Fab to Feb. 2027, Sets HBM Wafer Starts in Cheongju Next Month

14 ARTICLES

8mo ago

Nvidia Puts Rubin AI Platform Into Full Production, Open-Sources Alpamayo for Autonomous Vehicles

6 ARTICLES

8mo ago

EU Court Cuts Intel Antitrust Fine to €237 Million, Upholds 'Naked Restrictions' Finding

4 ARTICLES

8mo ago

EU General Court Cuts Intel Antitrust Fine to €237 Million

5 ARTICLES

10mo ago

Samsung and SK hynix Put HBM4 on Display at SEDEX as Next AI Memory Race Accelerates

9 ARTICLES

10mo ago

OpenAI’s 26-GW Chip Commitments Boost Supplier Outlook, Expose Financing and Power Hurdles

5 ARTICLES

11mo ago

AMD’s Strong Quarter Collides With Split Street as HSBC Trims Target and AI Pricing Assumptions

6 ARTICLES

last yr.

Intel Nova Lake Enters Pre-QS With 28-Core Desktop Sample as Company Targets 2026 High-End Comeback

23 ARTICLES

last yr.

AMD Unveils Instinct MI350 and MI400 Series GPUs, Previews Open-Standard Helios Rack Server

3 ARTICLES

last yr.

U.S.-China AI Chip Dispute Escalates as Beijing Threatens Legal Action

4 ARTICLES

last yr.

Qualcomm Announces Return to Data Center Market with Arm-Based CPUs

5 ARTICLES

last yr.

United Microelectronics and GlobalFoundries Reportedly Exploring Strategic Merger

6 ARTICLES

last yr.

Former Intel CEO Calls for Board Overhaul and Gelsinger's Reinstatement

7 ARTICLES

last yr.

China Launches Probe Into U.S. Chip Subsidies Over Alleged Unfair Competition

Market Competition

Samsung Delays Full High‑NA EUV Rollout to Its 1nm Node

Samsung Tops Global Chipmakers With Nearly 90 Trillion Won in 2025 Investment

Samsung’s Lee Visits Taiwan to Court MediaTek as a Foundry Client

Arm Reports Record Sales as AI Orders Top $2 Billion but Supply Falls Short

GlobalFoundries Sues Tower Semiconductor Over 11 Patents, Seeks U.S. Import Ban

ASML Validates 1,000‑W EUV Light Source, Targeting 50% Higher Wafer Throughput by 2030

SK Hynix Pulls Forward Yongin Fab to Feb. 2027, Sets HBM Wafer Starts in Cheongju Next Month

Nvidia Puts Rubin AI Platform Into Full Production, Open-Sources Alpamayo for Autonomous Vehicles

EU Court Cuts Intel Antitrust Fine to €237 Million, Upholds 'Naked Restrictions' Finding

EU General Court Cuts Intel Antitrust Fine to €237 Million

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Market Competition

Samsung and SK hynix Put HBM4 on Display at SEDEX as Next AI Memory Race Accelerates

OpenAI’s 26-GW Chip Commitments Boost Supplier Outlook, Expose Financing and Power Hurdles

AMD’s Strong Quarter Collides With Split Street as HSBC Trims Target and AI Pricing Assumptions

Intel Nova Lake Enters Pre-QS With 28-Core Desktop Sample as Company Targets 2026 High-End Comeback

AMD Unveils Instinct MI350 and MI400 Series GPUs, Previews Open-Standard Helios Rack Server

U.S.-China AI Chip Dispute Escalates as Beijing Threatens Legal Action

Qualcomm Announces Return to Data Center Market with Arm-Based CPUs

United Microelectronics and GlobalFoundries Reportedly Exploring Strategic Merger

Former Intel CEO Calls for Board Overhaul and Gelsinger's Reinstatement

China Launches Probe Into U.S. Chip Subsidies Over Alleged Unfair Competition

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Market Competition