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China’s CXMT Says Fifth‑Generation DRAM Platform Enters Mass Production

The G5 process uses quadruple patterning to shrink active‑area spacing to about 11.95 nm, increasing gross dies per wafer and cutting unit costs

CXMT Plans Beijing NAND R&D Line to Enter Flash-Memory Market

TSMC Posts Record August Revenue as AI Demand Strains Capacity

Skyworks CEO Says $22 Billion Qorvo Merger Is in Final Stages

CXMT Overtakes Tencent as China’s Most Valuable Company

Samsung Delays Full High‑NA EUV Rollout to Its 1nm Node

Samsung’s Lee Visits Taiwan to Court MediaTek as a Foundry Client

Arm Reports Record Sales as AI Orders Top $2 Billion but Supply Falls Short

GlobalFoundries Sues Tower Semiconductor Over 11 Patents, Seeks U.S. Import Ban

ASML Validates 1,000‑W EUV Light Source, Targeting 50% Higher Wafer Throughput by 2030

SK Hynix Pulls Forward Yongin Fab to Feb. 2027, Sets HBM Wafer Starts in Cheongju Next Month

EU Court Cuts Intel Antitrust Fine to €237 Million, Upholds 'Naked Restrictions' Finding

Samsung and SK hynix Put HBM4 on Display at SEDEX as Next AI Memory Race Accelerates

OpenAI’s 26-GW Chip Commitments Boost Supplier Outlook, Expose Financing and Power Hurdles

AMD’s Strong Quarter Collides With Split Street as HSBC Trims Target and AI Pricing Assumptions

Intel Nova Lake Enters Pre-QS With 28-Core Desktop Sample as Company Targets 2026 High-End Comeback

AMD Unveils Instinct MI350 and MI400 Series GPUs, Previews Open-Standard Helios Rack Server

Qualcomm Announces Return to Data Center Market with Arm-Based CPUs