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High-Bandwidth Memory

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Samsung and Broadcom Sign $200 Billion MOU Tying HBM, 2nm Foundry and Packaging

The pact locks a potential long‑term source of high‑bandwidth memory for Broadcom while repositioning Samsung to win more work at 2nm and below.

Micron Breaks Ground on ¥1.5 Trillion Hiroshima Expansion

SK Hynix Moves to List ADRs on Nasdaq, Targeting July 10

Intel Names Seok‑Hee Lee to Lead Standalone Advanced Packaging Unit

SK hynix Announces iHBM, Embeds Cooling Elements Inside HBM Packages

Morgan Stanley Estimates Nvidia Vera Rubin Rack BoM at $7.8M

Reports Point to Samsung HBM Packaging for Exynos to Boost On-Device AI

Leveraged DRAM Product Filed as Memory ETF Becomes Fastest to $6.5 Billion

South Korea Jails Ex-Samsung Researcher for 7 Years Over DRAM Leak to China’s CXMT

Micron’s Rally Extends on Record Outlook as HBM Capacity Is Booked Into 2027

Framework Warns AI Boom Imperils Personal Computing Ahead of April 21 'Next Gen' Launch

SK Hynix Files Record $8 Billion Order for ASML EUV Tools for 2027 Delivery

Samsung Commits 110 Trillion Won for 2026 to Speed Its Push in AI Chips

Applied Materials Raises Outlook on AI-Fueled Demand; Shares Jump

Samsung’s HBM4 Leads Nvidia’s Late-Stage Tests for Rubin as Contract Decisions Near

Micron Reportedly Plans ¥1.5 Trillion HBM Fab in Hiroshima Backed by Japanese Subsidies

Samsung Reportedly Clears Nvidia’s HBM3E Qualification, Turbocharging Shares and the Memory Outlook

Samsung Passes Nvidia's HBM3E Quality Test, Joining the Supply Chain

Micron Poised for Q3 Earnings Release After 95% Stock Surge

Micron Pledges $200 Billion to Expand U.S. Memory Manufacturing With Trump Administration Backing