Overview
- The Information reported that TSMC is considering internal plans to make advanced 3D DRAM at Nvidia’s request and several outlets have corroborated the reporting, but TSMC and Nvidia have not confirmed the plans.
- The company is said to be studying multiple paths, including building new fabs or acquiring and converting existing plants, and the effort is reportedly led by Hsu Kuo-chin of TSMC’s advanced packaging group.
- There is no public announcement, no capital commitment and no production timeline reported, so the project remains at an early, exploratory stage rather than in execution.
- Markets reacted to the reports with declines in memory makers’ shares such as Micron and SK Hynix and a rise in TSMC stock, reflecting investor bets about how a new supplier could change supply and pricing.
- If TSMC moves forward it would enter a capital- and time-intensive market that is dominated by Samsung, SK Hynix and Micron, and the practical effects on HBM and DRAM supply would likely take years to materialize rather than immediately resolving current AI-driven shortages.