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Lee Travels to San Francisco to Press U.S. AI Firms on Korea’s Chip and AI Megaprojects

The trip aims to secure U.S. investment, corporate partnerships and research ties to speed Korea’s nationwide semiconductor and AI capacity buildout.

Apple and Broadcom Agree to $30 Billion U.S. Chip Deal

Kioxia Begins Mass Production of 332‑Layer Flash at Kitakami

SK hynix Files for Massive Nasdaq ADS Offering to Fund AI Memory Buildout

Samsung Confirms Exynos 2700 Development for Flagship Phones

Amazon Explores Selling Trainium AI Chips to Third-Party Data Centers

Samsung Ships World’s First 12‑Layer HBM4E Samples

Netrasemi A2000 Completes Silicon Bringup and Prepares for Production

TSMC Lifts 2030 Chip Market Outlook to $1.5 Trillion on AI Surge

Intel Jumps 24% on Strong AI-Driven Outlook

Leaked Benchmarks Point to 5GHz MediaTek Dimensity 9600 Pro With Big Gains

Suspected Exynos 2700 Appears on Geekbench With 10-Core Layout

Samsung Shares Hit Record on Reports of $700 HBM4 Pricing and Premium Nvidia Tier

Apple’s Record iPhone Quarter Collides With AI-Driven Memory Squeeze

TSMC Steps Up Arizona Expansion as Taiwan Land Limits Bite and U.S.–Taiwan Tariff Deal Nears

U.S.–Taiwan Chip Pact Cuts Tariffs and Pledges $500 Billion Toward U.S. Production

Dutch Court Weighs Nexperia–Wingtech Control Case, No Ruling Yet

CXMT Files for 29.5 Billion Yuan Star Market IPO to Scale DRAM Production

Report Links €6.7 Million Dutch Estate to Suspended Nexperia Chief as Government Uses 1952 Law

Nexperia China Defies Dutch Control as Export Curbs Squeeze Europe’s Auto Supply