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Chip Design

Zen 5 Strix Point APU Core Complex Die Dual-Chiplet Design Zen 5 Chiplet Design Heterogeneous Chiplet Architecture 3-nm Process Xeon TSMC 3nm LA664 Core Architecture

Intel Confirms Diamond Rapids Xeon 7 Will Ship in 2027 on Refined 18A‑P

Intel says the design raises core counts, doubles memory bandwidth and adds PCIe 6.0 to target data‑center or AI workloads.

Leaks Detail Intel’s 900‑Series Nova Lake Platform, From Z990 OC Policies to 700W Peak Claims

Intel Details Panther Lake for 2026 Laptops and Xeon 6+ ‘Clearwater Forest’ With 288 E-Cores

Qualcomm Details SiP Memory and Hybrid 3nm for X2 Elite Extreme, Debuts Snapdragon 8 Elite Gen 5

Nvidia Details GB10 for DGX Spark and Blackwell Ultra GB300, Backed by Hot Chips Disclosures and Early Deployments

Nvidia Faces Setbacks as Blackwell AI GPUs Struggle With Overheating and Design Flaws

AMD's Ryzen 7 9800X3D Set to Launch, Promises Gaming Performance Boost

Intel Launches Xeon 6P and Gaudi 3, Aims to Reclaim Data Center Market Share

AMD Unveils Strix Point Mobile Chips with Major Upgrades