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NITI Aayog Roadmap Recommends India Shift From Cutting‑Edge Fabs to Advanced Packaging and Design

It urges a government anchor of about $45–60 billion to attract private capital, targeting a top‑three global role in advanced packaging by 2035.

Mexico Bets on Chip Design as Experts Urge Patience on Fab Ambitions

Karnataka Clears Space, IT Policies and LEAP to Scale Tech Exports and Jobs by 2030

Malaysia Partners with Arm in $250M Deal to Advance AI Chip Design