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TSMC Moves to Copy Intel’s EMIB as Packaging Bottleneck Chokes AI Chip Supply

The shift shows who assembles multi-die modules will decide how fast hyperscalers receive next-generation AI processors.

Samsung Prepares to Produce Tesla’s AI5 on 2nm at Taylor, Texas Fab

Google Seeks Samsung for Icefish I/O Die as MediaTek Moves to System-Level AI Hardware

OpenAI’s 26-GW Chip Commitments Boost Supplier Outlook, Expose Financing and Power Hurdles

AMD Finalizes $3 Billion Sale of ZT Systems' Manufacturing Arm to Sanmina