Semiconductor Industry

Market Competition Market Dynamics Innovation Market Growth DRAM Market Intel's Turnaround Wafer Foundry Silicon Carbide Market Chip Manufacturing Investment Growth

3 ARTICLES

3w ago

Intel Names Seok‑Hee Lee to Lead Advanced Packaging for Its Foundry

The move creates a standalone packaging business intended to speed EMIB‑T and HBI to high-volume production and strengthen system integration for AI and high-performance computing.

4 ARTICLES

last mo.

NVIDIA and TSMC Move GPU‑Accelerated AI Directly Into Chip Fabs

11 ARTICLES

last mo.

ASML Says First High‑NA Chips Are Weeks Away as Customers Split Over $400M Tool Cost

8 ARTICLES

2mo ago

Cadence Launches ChipStack AI ‘Super Agent’ for Chip Design, Citing Up to 10x Speedups

8 ARTICLES

5mo ago

Qualcomm Outlook Cuts Send Shares Lower as Memory Shortage Squeezes Smartphone Supply

15 ARTICLES

5mo ago

ASML Sets Records and Lifts 2026 Outlook on AI Tool Demand, Plans 1,700 Job Cuts

6 ARTICLES

6mo ago

U.S. Pushes Pax Silica Tech Coalition, Signals 2026 Expansion That Could Include India

3 ARTICLES

7mo ago

Morgan Stanley Names Micron Top Pick, Raises Target to $338 on Tight Memory Supply

5 ARTICLES

8mo ago

South Korea Steps Up AI Buildout as Big Tech Bets Grow, Stirring a Debate Over Sovereignty and Power Limits

11 ARTICLES

9mo ago

OpenAI Strikes Multi‑Year AMD Deal for Up to 6 GW of AI Accelerators, With Equity Warrants Tied to Milestones

4 ARTICLES

9mo ago

China Deepens AI Chip Shift With Tencent’s Pivot and Unicom’s Alibaba-Powered Data Center

8 ARTICLES

10mo ago

DeepSeek Releases V3.1, Tunes FP8 Format for Forthcoming Chinese AI Chips

5 ARTICLES

last yr.

Micron Shares Climb on Surging AI Memory Demand and Upbeat Outlook

6 ARTICLES

last yr.

Former Intel CEO Calls for Board Overhaul and Gelsinger's Reinstatement

10 ARTICLES

last yr.

Intel Faces Uncertain Future as Breakup and Sale Speculation Intensifies

4 ARTICLES

last yr.

Imec and ASML Achieve Breakthrough in High NA EUV Lithography

Semiconductor Industry

Intel Names Seok‑Hee Lee to Lead Advanced Packaging for Its Foundry

NVIDIA and TSMC Move GPU‑Accelerated AI Directly Into Chip Fabs

ASML Says First High‑NA Chips Are Weeks Away as Customers Split Over $400M Tool Cost

TSMC Sets 2029 Targets for A13 and A12, Delaying High‑NA EUV

Micron Soars on AI Memory Crunch as Analysts Lift Targets to $600

Gulf Attacks Cripple Qatar Helium, Putting Advanced Chip Supply on Edge

Applied Materials Raises Outlook on AI-Fueled Demand; Shares Jump

Cadence Launches ChipStack AI ‘Super Agent’ for Chip Design, Citing Up to 10x Speedups

Qualcomm Outlook Cuts Send Shares Lower as Memory Shortage Squeezes Smartphone Supply

ASML Sets Records and Lifts 2026 Outlook on AI Tool Demand, Plans 1,700 Job Cuts

Never miss stories about

Semiconductor Industry

U.S. Pushes Pax Silica Tech Coalition, Signals 2026 Expansion That Could Include India

Morgan Stanley Names Micron Top Pick, Raises Target to $338 on Tight Memory Supply

South Korea Steps Up AI Buildout as Big Tech Bets Grow, Stirring a Debate Over Sovereignty and Power Limits

OpenAI Strikes Multi‑Year AMD Deal for Up to 6 GW of AI Accelerators, With Equity Warrants Tied to Milestones

China Deepens AI Chip Shift With Tencent’s Pivot and Unicom’s Alibaba-Powered Data Center

DeepSeek Releases V3.1, Tunes FP8 Format for Forthcoming Chinese AI Chips

Micron Shares Climb on Surging AI Memory Demand and Upbeat Outlook

Former Intel CEO Calls for Board Overhaul and Gelsinger's Reinstatement

Intel Faces Uncertain Future as Breakup and Sale Speculation Intensifies

Imec and ASML Achieve Breakthrough in High NA EUV Lithography

Never miss stories about

Semiconductor Industry