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SK Hynix Launches iHBM to Embed Cooling Elements Inside HBM Packages

Silicon cooling inserts cut thermal resistance by about 30% to ease scaling of next‑generation AI memory.

Nvidia Reports $215.9 Billion, Extends AI Data-Center Lead Over AMD

TSMC Sets 2029 Targets for A13 and A12, Delaying High‑NA EUV

South Korea Jails Ex-Samsung Researcher for 7 Years Over DRAM Leak to China’s CXMT

RBC Lifts Marvell Price Target to $170 as Nvidia Deal Anchors AI Push

SEALSQ Pushes Post‑Quantum Chips as Anthropic’s Mythos Heightens Security Urgency

Broadcom Locks In Google TPU Deal Through 2031 and 3.5 GW Anthropic Access

Micron Extends AI-Fueled Rally as HBM Orders Are Booked Through 2026

China Denies Reports Its Firms Aided Iran’s Military During US–Israel War

ASML Falls After U.S. Bill Targets China Chip Tool Sales

Broadcom Extends AI Lead With Blowout Quarter and Higher Q2 Outlook as Insider Sales Draw Scrutiny

Arm Launches First In‑House AGI CPU for AI Data Centers

Elliott Takes Multibillion-Dollar Stake in Synopsys, Pushing for Stronger Software and Services Monetization

Eindhoven Clears Way for ASML Campus With Zoning Vote and Rare Nitrogen Permit

AARP, Dave Ramsey Split on When to Claim Social Security as Retirees Weigh Trade-Offs

Nvidia Rolls Out GeForce Hotfix to Remove Voltage Caps and Boost Requiem Path Tracing

Intel Names Craig Barratt Independent Chair as Frank Yeary Sets May Departure

NVIDIA Sets GTC 2026 for March 16–19 in San Jose, With Jensen Huang Keynote

ASML Sets Course Beyond EUV With Packaging Tools as High‑NA Progresses

Broadcom Targets 1 Million 3D Stacked AI Chips by 2027