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Chinese DRAM From CXMT Enters Commercial Kits and OEM Qualification

The move forces OEMs and cloud buyers to weigh lower-cost China-made memory against quality checks and U.S. export-control risk.

SK hynix Announces iHBM, Embeds Cooling Elements Inside HBM Packages

U.S. Orders Toolmakers to Halt Some Shipments to China’s Hua Hong

Global DRAM Shortage Set to Stretch Into 2027 as Supply Covers Only 60% of Demand

DRAM Shortage to Stretch Into 2027 as AI Memory Soaks Up New Capacity

Samsung Winds Down LPDDR4 as Chinese Rivals Step In

Intel in Advanced Talks With Google and Amazon on AI Chip Packaging

Kaynes OSAT in Sanand Begins Production After Modi Inauguration

CPU Shortage Deepens as Intel Lifts Prices and AMD Prepares Increases

Gulf Attacks Cripple Qatar Helium, Putting Advanced Chip Supply on Edge

Tesla Sets March 21 Launch for Austin Terafab Chip Project

Samsung to Raise NAND Prices Again in Q2 as Memory Squeeze Deepens

Leak Points to Sony Holding 2027–Early 2028 PS6 Window Despite RAM Shortage

Modi Lays Foundation For HCL–Foxconn OSAT Plant In Jewar

Taiwan Rejects U.S. Push to Move 40% of Its Chip Capacity

NAND Price Spike Puts Samsung and SK Hynix on Track for Decade-High Margins

SK Hynix Pulls Forward Yongin Fab to Feb. 2027, Sets HBM Wafer Starts in Cheongju Next Month

AI Memory Boom Puts Samsung and SK hynix on Track for Record 2026 Profits

Intel Tested ACM Research Tools for 14A, Prompting Security Scrutiny

Mexico Bets on Chip Design as Experts Urge Patience on Fab Ambitions