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Peking University Unveils Prototype 3D EDA for Huawei’s LogicFolding Push

The development shows China pursuing 3D stacking and domestic design tools to try to close the chip gap created by export limits.

Intel Names Craig Barratt Independent Chair as Frank Yeary Sets May Departure

Taiwan Reaffirms N-2 Export Limits, Keeping TSMC’s Cutting Edge at Home