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Cornell Team Visualizes Atomic ‘Mouse Bite’ Defects Inside 3D Transistors

A Nature Communications study with TSMC, ASM, plus Imec presents an EMPAD-powered ptychography method as an 'atomic debugger' for chip fabrication.

Sydney Team Sets Triple-Junction Record as KTU Inorganic Cells Log 950-Hour Heat Run

3D Imaging Reveals Three Universal Double-Layer Patterns at Battery Interfaces