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Samsung Reports Prototype 900‑Layer V‑NAND Chip

Built by bonding two 450‑layer wafers with Cell Multi‑Bonding, the prototype could raise per‑chip capacity if it clears production and cost hurdles.

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Arm Shifts From IP Licensor to Seller With Its Own AGI Data‑Center CPU

Intel Rebounds After Five‑Day Slide as Analysts Raise Price Targets

ASML Lifts 2026 Sales Outlook as AI Chip Demand Accelerates

Apple and Intel Reported to Reach Framework for Limited Chip Production

Skyworks Beats Q2 Estimates, Secures $1B-Plus Android Win, Lifts Outlook

MaxLinear Soars 80% After Earnings Beat and Strong Data-Center Outlook

STMicroelectronics Tops Q1 and Raises Q2 Outlook as Demand Shows Early Rebound

Cramer Touts Intel Comeback Under Lip‑Bu Tan as Earnings Loom

Alibaba Unveils XuanTie C950, a RISC-V Server CPU Built for AI Agents

SK Hynix Files Record $8 Billion Order for ASML EUV Tools for 2027 Delivery

TSMC Posts Stronger Year-Over-Year Sales as Board Clears NT$115.6 Billion Dividend

Bumble Soars After Q4 Beat as Company Unveils AI-Driven Bumble 2.0

Intel Confirms AI Data-Center GPU Plan, Names Eric Demmers Chief Architect

Teradyne Stock Jumps on AI-Fueled Q4 Beat and Big Q1 Guidance

Storage Stocks Soar as Seagate’s Blowout Quarter and HAMR Sellout Stoke AI-Driven Supply Crunch

TSMC Rallies to Fresh Highs as AI Boom Deepens and U.S. Eases China-Plant Rules

Apple’s A20 on TSMC 2nm Reported at $280 Per Chip, an 80% Jump

RRP Semiconductor’s 55,000% Leap Triggers SEBI Probe and BSE Trading Curbs

Moore Threads Soars Fivefold in Shanghai Debut After $1.1 Billion IPO