Technology ❯ Semiconductors

Manufacturing Processes

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China Imposes Provisional Cash Deposits on Japanese Dichlorosilane Exports

MOFCOM says dumped pricing harmed domestic producers and will issue a final ruling by January 7, 2027.

Samsung Reportedly Plans Exynos 2700 Variant for Galaxy S27 Ultra

U.S. Moves to Expand Chip Tariffs That Reward Firms Building Plants in America

Intel Completes Roughly $20 Billion Share Sale to Finance Foundry Build-Out

Intel Keeps Raptor Lake and DDR4 Support as Nova Lake Is Slated for Desktop First

AMD Agrees to Buy Taalas to Add Model‑Specific AI Inference Chips

Samsung Tops Q2 as Memory Makers Sell Out 2027 DRAM Capacity

TSMC Adds $100 Billion to Arizona Plan as Profits Reach Record Highs

TSMC Moves to Copy Intel’s EMIB as Packaging Bottleneck Chokes AI Chip Supply

Samsung and Broadcom Sign $200 Billion MOU Tying HBM, 2nm Foundry and Packaging

Besi Bookings More Than Double as Hybrid Bonding Drives AI Equipment Demand

Tata’s Dholera Fab to Start on Mature Nodes and Aim for First Silicon by December 2026

China Halts Helium Exports, Raising Pressure on Global Chip Supply

Synopsys Ends Support for Fab Analytics to Push All‑In on AI Chip Design

Anthropic Opens Early Talks With Samsung to Explore Custom 2nm AI Chip

Andhra Pradesh Courts Chipmakers and Investors in Singapore

Hitachi and Intel Form Broad Pact to Accelerate Physical AI in Industry

Odisha Signs MoU With Intel and 3DGS for $3.3 Billion Substrate Plant

Peking University Unveils Prototype 3D EDA for Huawei’s LogicFolding Push

Intel Curtails Intel 7 PC Supply to Push OEMs Toward 18A Chips