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Leak Reveals MediaTek Dimensity 9500’s 40% GPU Efficiency Gain and 100 TOPS AI Power

Leaks suggest the unannounced chipset will use TSMC’s 3nm N3P process, with first implementation in Vivo’s X300 series.

Samsung Display Unveils MONTFLEX Foldable OLED Brand at Korea Display Exhibition

Apple’s ‘Made in India’ iPhones Sidestep Tariffs but Still Depend on China

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Samsung Confirms Exynos 2600 as First 2nm GAA Smartphone Chip

ARRI Unveils ALEXA 35 Xtreme with Up to 660 fps

Ambiq Micro Shares Nearly Double on NYSE Debut After $96M IPO

Foxconn Halts Trading to Announce Data Center Partnership with TECO

Samsung Embeds Internal Cooling Chip in Exynos 2600 for Galaxy S26

LG Innotek Invests $50 Million in Aeva for 4D LiDAR Partnership

NC State Demonstrates Smartphone-Sized Spectrometer With Sub-Millisecond Response

Rapidus Begins Prototyping 2nm Gate-All-Around Wafers at Hokkaido Fab

Scientists Achieve First Direct Optical Hall Effect Detection in Non-Magnetic Metals

Wafer-Scale Doping and Low-Temp Growth Advance 2D Semiconductor Integration

ITC Recommends U.S. Import Ban on BOE OLED Panels in Samsung Trade Secrets Case

Quantum Battery Breakthrough Extends Charge Time 1,000× and Proves Speed-Limit Advantage

India Eyes 'Localize-100' Tracker and Reverse-Engineering Drive to Offset China Mineral Curbs

German Industry Warns of Vulnerability as China Promises Fast-Track Rare Earth Permits

Apple Patent Reveals Stacked Sensor Aimed at 20-Stop HDR

Experts Advise Against Refrigerated Cooling as Smartphone Heat Threatens Battery and Display

Qualcomm to Dual-Source Snapdragon 8 Elite 2 With TSMC 3nm and Samsung 2nm Chips