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Intel CEO Announces Major Layoffs, $1.5 Billion in Cost Cuts, and Structural Overhaul

Lip-Bu Tan outlines sweeping changes to streamline operations, eliminate bureaucracy, and refocus Intel on its core semiconductor business.

Apple Reportedly Nearing Decision on Supplier for Foldable iPhone Displays

Disney Hires Former Meta Exec Andre Rohe to Lead New Product Engineering Division

AMD Ryzen AI Max+ Pro 395 'Strix Halo' APU Leaks Highlight Powerful Specs

Intel Finalizes Xe3 GPU Architecture, Begins Work on Xe4

LG Unveils Stretchable Display Expanding from 12 to 18 Inches

Apple's India iPhone Exports Surge to $6 Billion, Reducing China Dependency

SK Hynix Begins Mass Production of Industry-First 12-Layer HBM3E Memory

Apple Unveils AirPods 4 with Groundbreaking Active Noise Cancellation

Lando Norris Drives Life-Size LEGO McLaren P1 at Silverstone

Tecno Reveals Innovative Tri-Fold Smartphone Concept with 10-Inch Display

Revolutionary Micro-Cooling Chip to Enhance AI-Driven Mobile Devices

Figure 02: Advanced Humanoid Robot Unveiled with Enhanced AI and Design

Nvidia's Blackwell AI Chips Delayed by Design Flaws

Vayu Robotics Launches Cost-Effective, LiDAR-Free Delivery Robot

Volkswagen and XPeng Expand Partnership to Develop New EV Technologies