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Chip Design

Nvidia Next-Generation Chips Google Amazon AWS Advanced Technology AI Progress Cambricon Technologies Amazon Trainium Chinese Chipmakers Broadcom

TSMC Prioritizes Advanced Packaging and Pushes Back High‑NA EUV Rollout

The move shows TSMC is channeling investment into packaging to ease an AI bottleneck.

U.S.–Taiwan Tariff Deal Nears as TSMC Secures Arizona Land for Potential Expansion

Baidu and Huawei Cement Lead in China’s GPU Cloud as IPO Wave Accelerates

Amazon Unveils Trainium3 as AWS Touts Multi-Billion Trainium Business

ASML Posts Q3 Beat, Raises Outlook on EUV Strength and High‑NA Progress

Broadcom’s Q3 Tops Estimates as AI Sales Surge and Fourth Hyperscaler Places Production Orders

China’s Nvidia Alternative Push Gathers Pace as H20 Sales Stall and Cambricon Soars

Samsung Plans Up to $50 Billion U.S. Chip Investment to Secure Tariff Exemptions

TSMC Posts 40% Half-Year Revenue Gain as Q2 Exceeds Targets