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6h ago

Xiaomi to Unveil 3nm XRING 01 Chipset and Flagship Devices on May 22

The Chinese tech giant commits $6.9 billion over a decade to develop advanced in-house chips, signaling a push for technological self-reliance.

Xiaomi 15s Pro surfaced on the Geekbench database with model number 25042PN24C
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Xiaomi took initial steps into semiconductors for smartphones with the launch of the firm's first in-house chip -- the Surge S1 -- in 2017

Overview

  • Xiaomi has announced a May 22 event to debut its XRING 01 chipset, built on a 3nm process, alongside the Xiaomi 15s Pro, Pad 7 Ultra, and YU7 SUV.
  • The XRING 01 will feature a 10-core CPU and has achieved competitive Geekbench scores, rivaling top-tier chips like Snapdragon 8 Elite and Dimensity 9400.
  • The company has invested 13.5 billion yuan and deployed 2,500 R&D staff since 2021, with a new 50 billion yuan, ten-year plan starting in 2025.
  • This marks Xiaomi's return to chip development after halting its Surge S1 project in 2017 due to technical and financial challenges.
  • The move aligns with China's broader strategy to reduce reliance on U.S. and Taiwanese chip suppliers amidst ongoing trade tensions.